학술논문

DFF Layout Variations in CMOS SOI—Analysis of Hardening by Design Options
Document Type
Periodical
Source
IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 67(6):1125-1132 Jun, 2020
Subject
Nuclear Engineering
Bioengineering
Layout
Logic gates
Implants
MOSFET
Ions
Silicon
Radiation hardening by design (RHBD)
sequential circuits
single-event upset (SEU)
transmission gates
Language
ISSN
0018-9499
1558-1578
Abstract
Four D flip-flop (DFF) layouts were created from the same schematic in Sandia National Laboratories’ CMOS7 silicon-on-insulator (SOI) process. Single-event upset (SEU) modeling and testing showed an improved response with the use of shallow (not fully bottomed) N-type metal-oxide-semiconductor field-effect transistors (NMOSFETs), extending the size of the drain implant and increasing the critical charge of the transmission gates in the circuit design and layout. This research also shows the importance of correctly modeling nodal capacitance, which is a major factor determining SEU critical charge. Accurate SEU models enable the understanding of the SEU vulnerabilities and how to make the design more robust.