학술논문

Effective excursion detection by defect type grouping in in-line inspection and classification
Document Type
Periodical
Source
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 12(1):3-10 Feb, 1999
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Inspection
Monitoring
Noise reduction
Semiconductor device noise
Manufacturing processes
Semiconductor device manufacture
Delay
Optical losses
Quality management
Control charts
Language
ISSN
0894-6507
1558-2345
Abstract
In this paper, a new methodology for effective process excursion monitoring using defect review/classification information is proposed. We introduce a new defect classification scheme, in which relevant defect types that are likely to be caused by the same mechanism or source are grouped into a "defect family". It is demonstrated that trending by the defect family drastically improves the detection efficiency of killer defect excursion by reducing or eliminating noise resulting from irrelevant benign defects. We compare the risks of missing critical excursions for monitoring by total defect count, killer defect count, and killer defect family, and illustrate the effectiveness of our methodology using data from actual fabline.