학술논문

In-line inspection to wafer test correlation
Document Type
Conference
Source
IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings Advanced semiconductor manufacturing Advanced Semiconductor Manufacturing Conference and Workshop, 1996. ASMC 96 Proceedings. IEEE/SEMI 1996. :100-102 1996
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Inspection
Testing
Etching
Electron optics
Scanning electron microscopy
Microelectronics
Semiconductor device manufacture
Chemicals
Joining processes
Optical arrays
Language
ISSN
1078-8743
Abstract
A method for correlating optical in-line defects to electrically tested defects has been developed. Using this method, the validity of in-line defect categories and the possibility that they will cause a defect has been adjusted. This work was performed in one of two semiconductor fabricators at the IBM Microelectronics Division manufacturing facility in Essex Junction, Vermont.