학술논문

Manufacturability of superconductor electronics for a petaflops-scale computer
Document Type
Periodical
Source
IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 9(2):3202-3207 Jun, 1999
Subject
Fields, Waves and Electromagnetics
Engineered Materials, Dielectrics and Plasmas
Superconducting integrated circuits
Computer architecture
Throughput
Power dissipation
Manufacturing processes
Pulp manufacturing
Semiconductor device manufacture
Computer aided manufacturing
Foundries
Integrated circuit packaging
Language
ISSN
1051-8223
1558-2515
2378-7074
Abstract
Ultra-low power and ultra-high speed single-flux-quantum electronics is an enabling near-term technology solution for petaflops-scale computers. The proposed Hybrid Technology Multi-threaded (HTMT) petaflops computer architecture includes computational modules operating at 100 GHz and an I/O throughput of 32 Petabits/s. Due to fundamental time-of-flight and power dissipation limitations of semiconductor ICs, superconductor ICs at an integration level of 100 k gates/cm/sup 2/ are proposed for the HTMT computation modules. In this paper, we discuss the manufacturability of superconductor-based computation modules, including the IC foundry process, packaging, and data link out of the cryopackage. We focus on the critical technical challenges that exist in each of these areas and present a technology roadmap to achieve the HTMT requirements.