학술논문
A 1–170-GHz Distributed Down-Converter MMIC in 35-nm Gate-Length InGaAs mHEMT Technology
Document Type
Periodical
Author
Source
IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 32(6):748-751 Jun, 2022
Subject
Language
ISSN
1531-1309
1558-1764
1558-1764
Abstract
This letter demonstrates two distributed down-converter monolithic microwave integrated circuits (MMICs). MMIC1 contains a distributed down-conversion mixer and MMIC2 expands MMIC1 by an eight-cell distributed local oscillator (LO) driver amplifier. The letter includes an investigation of the optimal gate width for each of the transistors in the stack of the source-feedback mixer cells. The MMICs are fabricated in the Fraunhofer Institute for Applied Solid State Physics (IAF), Freiburg im Breisgau, Germany, 35-nm gate-length metamorphic high-electron-mobility transistor technology. MMIC2 achieves a conversion gain (CG) of better than −4.2 dB over a 1–170 GHz radio frequency (RF) bandwidth (BW) at a fixed intermediate frequency (IF) of 0.1 GHz. The LO power ( ${P}_{\text {LO}}$ ) of MMIC2 is only −1 dBm. Furthermore, the mixer has a variable gain feature. By adjusting ${P}_{\text {LO}}$ , the CG can be controlled without affecting the RF-input-power-related 1-dB CG compression of −1.7 dBm. To the best of the authors’ knowledge, this work demonstrates the largest BW for distributed down-conversion mixers and for distributed mixers (DMs) with a sliding LO.