학술논문

A 1–170-GHz Distributed Down-Converter MMIC in 35-nm Gate-Length InGaAs mHEMT Technology
Document Type
Periodical
Source
IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 32(6):748-751 Jun, 2022
Subject
Fields, Waves and Electromagnetics
Communication, Networking and Broadcast Technologies
Signal Processing and Analysis
Mixers
Radio frequency
Transistors
Logic gates
Transmission line measurements
Microwave transistors
Capacitance
Distributed amplifiers (DAs)
distributed mixers (DMs)
high-electron-mobility transistors (HEMTs)
metamorphic HEMTs (mHEMTs)
millimeter wave (mmW)
monolithic microwave integrated circuits (MMICs)
thin-film microstrip transmission lines (TFMSLs)
traveling-wave amplifiers (TWAs)
Language
ISSN
1531-1309
1558-1764
Abstract
This letter demonstrates two distributed down-converter monolithic microwave integrated circuits (MMICs). MMIC1 contains a distributed down-conversion mixer and MMIC2 expands MMIC1 by an eight-cell distributed local oscillator (LO) driver amplifier. The letter includes an investigation of the optimal gate width for each of the transistors in the stack of the source-feedback mixer cells. The MMICs are fabricated in the Fraunhofer Institute for Applied Solid State Physics (IAF), Freiburg im Breisgau, Germany, 35-nm gate-length metamorphic high-electron-mobility transistor technology. MMIC2 achieves a conversion gain (CG) of better than −4.2 dB over a 1–170 GHz radio frequency (RF) bandwidth (BW) at a fixed intermediate frequency (IF) of 0.1 GHz. The LO power ( ${P}_{\text {LO}}$ ) of MMIC2 is only −1 dBm. Furthermore, the mixer has a variable gain feature. By adjusting ${P}_{\text {LO}}$ , the CG can be controlled without affecting the RF-input-power-related 1-dB CG compression of −1.7 dBm. To the best of the authors’ knowledge, this work demonstrates the largest BW for distributed down-conversion mixers and for distributed mixers (DMs) with a sliding LO.