학술논문
Spintronics Technology Solutions for Interferometric Thermal-Electromagnetic Sensing
Document Type
Conference
Author
Source
2022 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Wireless and Microwave Circuits and Systems (WMCS), 2022 IEEE Texas Symposium on. :1-6 Apr, 2022
Subject
Language
Abstract
Hybrid electromagnetic (EM) and thermal imaging using spintronic technologies is proposed for sensing circuits and systems in near-field and far-field from DC (Switching-Power) to mmWave frequencies. High resolution spintronic sensors capable of detecting magnetic fields ranging from few tens of mT (milli-Tesla) down to tens of pT (pico-Tesla) are demonstrated spanning about 10 orders of magnitude in dynamic range. A configurable Agile Front-End-Module LNA (AFEM) is combined with spintronics probe-array sensors providing adjustable 80 dB of dynamic range for subsequent processing of MIMO correlations in time and frequency domains. The proposed hybrid EM-Thermal sensing solution is applied to mmWave beamforming modules demonstrating the possibility of extracting power-density and energy-density metrics as a function of beamforming angles. An infrared (IR)-Visual dual-camera is introduced together with augmented reality (AR) based on 3D non-uniform spatial-sampling. Porting of chemically functionalized spintronic sensing materials into advanced FD-SOI platforms is proposed using advanced MRAM/SRAM process technologies.