학술논문
Improving tomographic sensing of Scalpel SPM with multi-probe functionality and automatic removal rate extraction
Document Type
Conference
Author
Source
2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021
Subject
Language
ISSN
1946-1550
Abstract
We report on the use of a multi-probe sensing scheme for the implementation of tomographic atomic force microscopy. This leverages the use of three independent probes, alternating their operation on the same area of the sample surface, thus enabling fast tip replacement and high-resolution imaging. Here, two areas of improvement are discussed, namely (1) the development of a synchronized multi-probe sensing method for the accurate control of removed material, and (2), the creation of a data acquisition scheme for the automated extraction of removal rate.