학술논문
High resolution Magnetic Current Imaging for die level short localization
Document Type
Conference
Author
Source
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the. :347-350 Jul, 2013
Subject
Language
ISSN
1946-1542
1946-1550
1946-1550
Abstract
Magnetic Field Imaging (MFI) technology is capable of localize shorts using Magnetic Current Imaging (MCI) technique with a very high spatial resolution [1]. In this paper we demonstrate that a Giant Magneto Resistance (GMR) sensor positioned in close proximity to the front side of a die sample enables MFI to achieve sub micron resolution.