학술논문

In-Depth Investigation of Seed Layer Engineering in Ferroelectric Hf0.5Zr0.5O2 Film: Wakeup-Free Achievement and Reliability Mechanisms
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(2):1048-1053 Feb, 2024
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Capacitors
Iron
Hafnium oxide
Switches
Reliability
Voltage measurement
Zirconium
Ferroelectric (FE) capacitor
Hf₀.₅Zr₀.₅O₂(HZO)
oxygen vacancy
seed layer
wakeup-free
Language
ISSN
0018-9383
1557-9646
Abstract
Seed layer engineering in ferroelectric (FE) Hf0.5Zr0.5O2 (HZO) film has been investigated systematically in this work. Among four kinds of seed layers (ZrO2, HfO2, Al2O3, and TiO2), the HZO capacitor with TiO2 seed layer achieves preferable performance (larger Pr, smaller Ec, and nearly wakeup-free). It is considered that the suppression of interfacial defects by seed layers could be a key for wakeup-free achievement. For further understanding, with reliability characterizations and theoretical calculations, it is found that defects (oxygen vacancy $\text{V}_{\text {O}}^{+}$ ) generation at the TiN/HZO interface and their migration into inner film could be dominant reasons for the leakage and Pr degradation in cycling, while $\text{V}_{\text {O}}^{+}$ at the TiO2/TiN interface can attribute to the imprint effect. Thereby, a novel asymmetric stress field cycling (ASFC) scheme is proposed to suppress Pr fatigue by keeping defects at one-side interface rather than migrating into the inner film.