학술논문
Surface Attach Chip Carriers for Conventional and High-Performance Applications
Document Type
Periodical
Author
Source
IEEE Transactions on Components, Hybrids, and Manufacturing Technology IEEE Trans. Comp., Hybrids, Manufact. Technol. Components, Hybrids, and Manufacturing Technology, IEEE Transactions on. 10(2):152-158 Jun, 1987
Subject
Language
ISSN
0148-6411
1558-3082
1558-3082
Abstract
Three types of surface attach chip carriers are available for systems use: leadless ceramic and plastic packages, leaded plastic and ceramic packages, and a new updated version of the leadless ceramic packages suitable only for socketing. These new packages have high lead count, copper leads, and provisions for internal decoupling capacitors. These three packaging types and the important role that sockets play in system design are discussed.