학술논문

New qualified industrial AlGaN/GaN HEMT process: Power performances & reliability figures of merit
Document Type
Conference
Source
2012 7th European Microwave Integrated Circuit Conference Microwave Integrated Circuits Conference (EuMIC), 2012 7th European. :317-320 Oct, 2012
Subject
Fields, Waves and Electromagnetics
Computing and Processing
Components, Circuits, Devices and Systems
Gallium nitride
Transistors
Temperature measurement
Logic gates
Integrated circuit reliability
Aluminum gallium nitride
AlGaN/GaN HEMT
power transistor
technology
reliability
robustness
Language
Abstract
This paper describes the performances of a new power 0.5 µm gate length AlGaN / GaN HEMT process named GH50_10. This process has been developed to address applications and market needs up to 7 GHz. A specific emphasis has been attached to find a trade- off in between power / efficiency and linearity. After an introduction of the context, a short description of the process manufacturing is given including spread of the DC parameters. From the qualification procedure, key reliability figures of the process are presented like the main energy of activation and an evaluation of the Median Time to Failure, evaluated respectively to 1.95ev and 10 6 hours at 200°C. Power performances are presented from L to C bands from 15W for the elementary power transistors to 50W for high power packaged transistors. This technology is presently available at industrial level to address products requirements for telecom and military needs. Compliance to space requirement is underway