학술논문

Thickness measurement of ultra-thin gate dielectrics under inversion condition
Document Type
Conference
Source
2001 International Symposium on VLSI Technology, Systems, and Applications. Proceedings of Technical Papers (Cat. No.01TH8517) VLSI technology, systems, and applications VLSI Technology, Systems, and Applications, 2001. Proceedings of Technical Papers. 2001 International Symposium on. :212-215 2001
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Computing and Processing
Signal Processing and Analysis
Thickness measurement
Dielectric measurements
Electrical resistance measurement
Ultra large scale integration
Thickness control
Current measurement
Leakage current
Measurement errors
Optimization methods
Frequency modulation
Language
ISSN
1524-766X
Abstract
Accurate measurement of inversion thickness is essential in ULSI technology for development and control of ultra-thin gate dielectric processes. However, the accuracy of the measurement can be severely affected by the high gate leakage current and series resistance. This paper presents a methodology to reduce the measurement error by optimizing the ac modulation frequency and test device structures.