부산대학교 도서관

Thermoset-based adhesives are used as thermal and electrical interfaces. In automotive applications, they are required to have excellent adhesion since delamination may precipitate other electrical, thermal or mechanical failure mechanisms. A vast amount of literature is available on the investigation of molding compounds and various material interfaces. However, only very few studies focus on delamination of adhesive interfaces. The reason is that apparently it was not possible to initiate an interface crack in a delamination sample. In various attempts, random cracking in the adhesive was obtained instead. Yet interface cracks are found in real products and really form a reliability issue. But so far the absence of adequate interface strength data makes it hardly possible to design for reliability of products with adhesive interfaces.