학술논문

1.1 A/mm ß-Ga2O3-on-SiC RF MOSFETs with 2.3 W/mm Pout and 30% PAE at 2 GHz and fT/fmax of 27.6/57 GHz
Document Type
Conference
Source
2023 International Electron Devices Meeting (IEDM) Electron Devices Meeting (IEDM), 2023 International. :1-4 Dec, 2023
Subject
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Nuclear Engineering
Photonics and Electrooptics
Power, Energy and Industry Applications
Robotics and Control Systems
Signal Processing and Analysis
Radio frequency
Performance evaluation
Silicon carbide
Transistors
Substrates
Power generation
Resistance heating
Language
ISSN
2156-017X
Abstract
This work demonstrates for the first time the power performance of ß-Ga 2 O 3 RF transistors at 2-8 GHz with a record high output power density (P out ) of 2.3 W/mm and a power-added efficiency (PAE) of 30% at 2 GHz. Such P out and PAE are 25 and 3 times of previous state-of-the-art ß-Ga 2 O 3 RF power devices at 2 GHz, respectively. In addition, the device shows a maximum on-current (I D,max ) of 1.1 A/mm and a f T /f max of 27.6/57 GHz, all among the highest in ß-Ga 2 O 3 RF devices. Such RF performances are enabled by transferring a heavily-doped ß-Ga 2 O 3 channel to a SiC substrate, which significantly reduce the on-resistance and improve the heat dissipation, as well as deploying an insulated and recessed T- gate to simultaneously enhance the frequency performance and electric field management. These results indicate a remarkable progress in the field of ß-Ga 2 O 3 RF power devices and show the promise of ß-Ga 2 O 3 -on-SiC platform for high-power, high- frequency, high-efficiency RF applications.