학술논문

Silicon Compatible Process To Integrate Impedance Cytometry With Mechanical Characterization
Document Type
Conference
Source
2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2023 IEEE 36th International Conference on. :475-478 Jan, 2023
Subject
Bioengineering
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Electrodes
Micromechanical devices
Mechanical sensors
Spectroscopy
Actuators
Three-dimensional displays
Silicon
3D electrodes
impedance cytometry
single-cell analysis
microfabrication
Language
ISSN
2160-1968
Abstract
We introduced 3D silicon electrodes to perform impedance cytometry on single cells without compromising practical integration with sensors measuring complementary properties, e.g., mechanical properties. Microfabricated from a highly-doped SOI wafer, some design modifications were made to improve their sensing performance. According to simulations, a trajectory-free measurement can be obtained by replacing the silicon backside under the sensing area with an insulating material. In addition, enlarging the distance between the electrodes and the surrounding silicon structure and filling them with some insulating material results experimentally in better signal quality and reduced parasitics. Combining these two device modifications improves the system frequency response and the signal quality at higher frequencies. The proposed process aims at creating silicon-based electrodes for impedance spectroscopy applications while providing opportunities to integrate them with MEMS sensors and actuators.