학술논문
Substrate Transfer: an Enabling Technology for System-in-Package Solutions
Document Type
Conference
Author
Source
2006 Bipolar/BiCMOS Circuits and Technology Meeting Bipolar/BiCMOS Circuits and Technology Meeting, 2006. :1-8 Oct, 2006
Subject
Language
ISSN
1088-9299
2378-590X
2378-590X
Abstract
A simple and robust technology for the transfer of circuits, processed on normal silicon wafers, to alternative substrates is presented. Substrate Transfer Technology (STT) is a post-processing technology based on adhesive bonding using a UV curing adhesive. We demonstrate that STT can be used for the elimination of RF substrate losses, for double sided device processing and for the fabrication of flexible circuits and thermal sensors and actuators. The successful industrialization of the process demonstrates that STT is indeed a viable option for high-yield, low-cost mass production.