학술논문

Electromigration in tin-bismuth planar solder joints
Document Type
Conference
Source
2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :201-202 Apr, 2023
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Photonics and Electrooptics
Power, Energy and Industry Applications
Signal Processing and Analysis
Electromigration
Resistance
Geometry
Temperature distribution
Bismuth
Real-time systems
Soldering
tin-bismuth
planar solder geometry
back stress
Language
Abstract
A novel planar solder geometry is described that allowed real-time. non-destructive monitoring of the rate of bismuth segregation at the anode in eutectic Sn-Bi solder joints of lengths in the range 180-450 µm at various current densities and temperatures while tracking the extent of electromigration by electrical resistance means. The rate of bismuth segregation was found to be somewhat proportional to the solder joint length indicating a probable Blech back-stress effect. Initially, the solder joint electrical resistance decreased followed by an increase. The period of decreasing electrical resistance was much less at higher current densities. The electromigration activation energy was determined to be 0.92 eV.