학술논문

Development of Large Diameter Semi-Insulating Gallium Oxide (Ga2O3) Substrates
Document Type
Periodical
Source
IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 32(4):466-472 Nov, 2019
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Crystals
Gallium
Iridium
Atmosphere
Substrates
Gallium nitride
Photonic band gap
Crystal growth
Czochralski
gallium oxide
wide bandgap semiconductors
Language
ISSN
0894-6507
1558-2345
Abstract
Beta-phase gallium oxide ( ${{\beta }}$ -Ga 2 O 3 ) is an emerging ultra-wide bandgap semiconductor targeting next generation high power switching and high voltage RF electronics. ${{\beta }}$ -Ga 2 O 3 possesses a bandgap ( ${\text{E}}_{g}$ ) of approximately 4.9 eV and a theoretical critical field strength ( ${\text{E}}_{c}$ ) of 8 MV/cm. The breakdown field for ${{\beta }}$ -Ga 2 O 3 is 2 - 3 times larger than that of silicon carbide (SiC) or gallium nitride (GaN). The Baliga figure of merit for ${{\beta }}$ -Ga 2 O 3 is at least three times GaN and eight times SiC making it a promising low-loss power switch material. Breakdown voltages of 1.6 kV and 740 V have been achieved for ${{\beta }}$ -Ga 2 O 3 Schottky diodes and MOSFETs respectively. Lateral device electric fields of 3.8 MV/cm have also been demonstrated. Critical to this performance realization are the availability of native ${{\beta }}$ -Ga 2 O 3 substrates. ${{\beta }}$ -Ga 2 O 3 single crystals are produced by crystallization from a melt utilizing high growth rate processes such as Czochralski (CZ) or Edge-defined Film-fed Growth (EFG) techniques. Through Air Force Research Laboratory support, Northrop-Grumman SYNOPTICS has successfully scaled the growth of unintentionally doped (UID), Mg-doped and Fe-doped ${{\beta }}$ -Ga 2 O 3 crystals from self-nucleated polycrystalline grains on iridium wire to seeded (010) oriented 50-mm diameter boules. Efforts directed at establishing growth and fabrication processes will be reviewed.