학술논문

Highly sensitive force sensor featuring a MEMS-instrumented buckling lamella
Document Type
Conference
Source
2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-6 May, 2023
Subject
Components, Circuits, Devices and Systems
Micromechanical devices
Temperature sensors
Temperature dependence
Sensitivity
Force
Strain measurement
Load management
MEMS
semi conductive strain gauge
load cell
weighing
high sensitivity
finite element analysis
Language
ISSN
2768-1874
Abstract
This paper presents the design procedure, fabrication process, and experimental results of a high-sensitivity 100 N force sensor used as a weighing load cell. It incorporates MEMS semiconductor strain gauges that are bonded to a buckling lamella. A stainless steel single-point test body bears the force load, and its deflection causes the lamella to buckle. Due to the higher gauge factor of the silicon strain gauges, this sensor has a rated output four times higher than commercial load cells equipped with metallic strain gauges. This increased sensitivity enables the detection of force variations as low as 0.01% of the rated output.