학술논문
Highly sensitive force sensor featuring a MEMS-instrumented buckling lamella
Document Type
Conference
Author
Source
2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-6 May, 2023
Subject
Language
ISSN
2768-1874
Abstract
This paper presents the design procedure, fabrication process, and experimental results of a high-sensitivity 100 N force sensor used as a weighing load cell. It incorporates MEMS semiconductor strain gauges that are bonded to a buckling lamella. A stainless steel single-point test body bears the force load, and its deflection causes the lamella to buckle. Due to the higher gauge factor of the silicon strain gauges, this sensor has a rated output four times higher than commercial load cells equipped with metallic strain gauges. This increased sensitivity enables the detection of force variations as low as 0.01% of the rated output.