학술논문

Robust PoP probing solutions for high-performance application processor developments
Document Type
Conference
Source
2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems Electrical Performance of Electronic Packaging and Systems (EPEPS), 2013 IEEE 22nd Conference on. :159-162 Oct, 2013
Subject
Components, Circuits, Devices and Systems
Probes
Resistors
Sockets
Loading
Microwave theory and techniques
Accuracy
Mobile communication
package-on-package (PoP)
application processor (AP)
probing
waveform reconstruction
de-embedding
Language
ISSN
2165-4107
2165-4115
Abstract
Probing solution is crucial for the designs and validation of high-speed PoP devices in high-performance mobile application processor (AP) development, where PoP assembly technology is used to achieve high data throughput & low cost. The paper has developed robust PoP probing solution for AP product development based on microwave network theory, including probe loading effect minimization, probing channel propagation removal, waveform reconstruction at die pad and interposer/socket de-embedding, which are applied to the latest mobile application processor development. It is also straight forward and natural to extend the developed methods to TSV-based devices with WideIO interface.