학술논문
TaN thin film study for Superconducting BEOL integration
Document Type
Conference
Author
Source
2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM) Advanced Metallization Conference (MAM)(IITC/MAM), 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for. :1-3 May, 2023
Subject
Language
ISSN
2380-6338
Abstract
Superconducting materials integration is one of the emerging subjects for quantum applications. This paper proposes an integration scheme based on superconducting layer etching. A material selection is proposed for interconnections including metal and dielectric. Then, a focus is realised on TaN layers as a potential technological choice. The deposition process window is explored in term of N 2 flow and thickness leading to a T c up to 2 K for 40 nm of TaN.