학술논문

The effect of forming gas annealing on Al/Ti/n-Si contacts
Document Type
Conference
Source
2022 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2022 International. :127-130 Oct, 2022
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Temperature measurement
Temperature distribution
Semiconductor device measurement
Annealing
Atmospheric measurements
Contacts
Silicides
Ti
Schottky contact
inhomogeneity
wide temperature range
p-diode model
Language
ISSN
2377-0678
Abstract
Al/Ti/n-Si contacts without and with post-metallization annealing in forming gas atmosphere are fabricated and characterized. X-ray diffraction measurements are performed in order to identify possible types of silicides that appear after annealing. The results show different phases of Ti silicide, such as TiSi 2 and Al 5 Ti 7 Si 12 . The metal/semiconductor contacts are electrically characterized at different temperatures, over a wide range (60 - 500K). For the as-deposited sample, an ohmic-like behavior is observed over almost the whole temperature domain. Instead, the annealed Al/Ti/n-Si contact exhibits Schottky-like behavior with very good performances, as assessed with our p-diode model. It is evinced that, for the 140 - 420K temperature range and 1μA -100mA current interval, a single dominant contact region is responsible for forward current flow. Under lilA and below 140K, it is necessary to consider two additional contact regions in the p-diode model.