학술논문
Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices
Document Type
Conference
Source
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 2015 IEEE International. :233-236 May, 2015
Subject
Language
ISSN
2380-632X
2380-6338
2380-6338
Abstract
Thick electroplated Cu bond pads have lately been demonstrated to enable heavy Cu wire-bonding but the Cu oxides necessitate an additional cleaning step after the die-attach. To avoid such cleaning, the use of a thin Al layer is tested for its passivating ability on Cu bond pads and its suitability for the bonding process. Results show a significant improvement of the oxidation resistance and bonding performance.