부산대학교 도서관

Advanced packaging technologies open up a new range of possibilities for improved system integration. Especially in the field of RF, functionalities can be improved or enlarged by the interaction of packaging technology and RF design. In order to exploit this potential, the technologies must first be carefully characterized in terms of RF design, and the design itself must consistently exploit the opportunities that arise. In this paper, a holistic approach (M3-approach - Methodologies, Models, Measures) is applied for the efficient and accurate design of a 79 GHz radar. The application of advanced packaging technologies such as PCB embedding and compression molding opens the possibility to design a wide angle detection range and resolution MIMO radar frontend for autonomous driving application. First, based on the targeted application and the international regulatory requirements, we derive the component and system specifications of a MIMO hardware architecture. Based on the requirements, a combination of advanced packaging technologies (PCB embedding and compression molding) was selected to meet the application specific requirements. These technologies, their process tolerances and the substrates under consideration for application were evaluated by RF-measurements. Finally, the MIMO radar frontend-module was built up and successfully characterized.