학술논문
A 10 /spl mu/m thick RF-ID tag for chip-in-paper applications
Document Type
Conference
Author
Source
Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005. Biopolar/BiCMOS Circuits and Technology Bipolar/BiCMOS Circuits and Technology Meeting, 2005. Proceedings of the. :18-21 2005
Subject
Language
ISSN
1088-9299
2378-590X
2378-590X
Abstract
In CIRCONFLEX technology, circuits fabricated on SOI wafers are transferred to a 10 /spl mu/m thick polyimide carrier. The highly flexible circuits remain defect free even after bending to radii of less than 1 mm, making them attractive for chip-in-paper applications. The effect of bending on the transistors characteristics is very small as demonstrated in this paper. A fully autonomous RF-ID tag demonstrator circuit with integrated antenna, fabricated in CIRCONFLEX technology is presented. The 3/spl times/3 mm/sup 2/ tag operates up to 1.5 cm from the base station, and continues to function even while bent to a radius of 0.7 mm.