학술논문

The Cycle Time of Front end IC Manufacturing and Amhs Variability
Document Type
Conference
Source
2019 China Semiconductor Technology International Conference (CSTIC) China Semiconductor Technology International Conference (CSTIC), 2019. :1-3 Mar, 2019
Subject
Bioengineering
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Power, Energy and Industry Applications
Language
Abstract
Semiconductor manufacturing is a race for cycle time. Variability in the manufacturing process causes factory cycle times 2–3 times longer than the true front end processing time for an IC. Reducing variability is the key to efficient Fab operations. This two part study examines variability contributions of the inter process logistics. Manufacturing variability at the individual tool levels is amplified by the variability in the linking of process steps with AMHS. A stochastic simulation model of abstract substrate flow is constructed for: a) based on the current paradigm of inter process logistics, and b) based on that of a new hybrid AMHS concept. Fab OC curves are developed, highlighting differences in operating curves, which show the manipulating power of the AMHS on manufacturing process variability, and gains in cycle time via Hybrid AMHS.