학술논문

340-440mW Broadband, High-Efficiency E-Band PA's in InP HBT
Document Type
Conference
Source
2015 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Compound Semiconductor Integrated Circuit Symposium (CSICS), 2015 IEEE. :1-4 Oct, 2015
Subject
Aerospace
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Photonics and Electrooptics
Power, Energy and Industry Applications
Gain
Heterojunction bipolar transistors
Indium phosphide
III-V semiconductor materials
Bandwidth
Radio frequency
Gallium nitride
Language
ISSN
1550-8781
2374-8443
Abstract
Two E-band (71-76GHz and 81-86GHz) solid-state power amplifiers in 250nm InP HBT are reported. The 71-76GHz PA demonstrates 13.3-16.2dB S21 gain and 33GHz bandwidth. Output power from 71-81GHz is > 360mW. At 76GHz, 439mW Pout (26.4dBm) is achieved with 12.1dB gain and 26.9% PAE - this corresponds to 1.14W/mm power density. The 81- 86GHz PA demonstrates 12.0-14.3dB S21 gain and 40GHz bandwidth. Output power from 76-86GHz is > 337mW. At 86GHz, 358mW Pout (25.5dBm) is achieved with 10.2dB gain and 23.6% PAE - this corresponds to 0.93W/mm power density. This SSPA utilizes a novel, compact power cell topology developed for multi-finger HBTs, which overcomes the inability of the RF output interconnects and combiners to carry the high DC bias currents required by the InP HBT PA cells in the thin-film microstrip interconnect. This work improves upon the state- of-the-art for InP HBT and GaN HEMT E-Band SSPAs by demonstrating higher simultaneous power by 1.0- 2.0dB and large bandwidths, where PAE is > 15-20% in continuous wave (CW) operation. The size of the PA's is small, both only 1.95mm x 0.88mm.