부산대학교 도서관

This paper presents the development of a microwave module that doesn’t require a transition substrate to interface with the ridge gap waveguide (RGW). Furthermore, the module utilizes current mode combining at the package level to obtain higher output power density while maintaining a small size. The fabricated module is self-packaged and the chip carrier assembly allows for quick MMIC substitution/exchange in the event of device failure. The designed module operates between 11 – 14.5 GHz and simulation and measured results are compared.