학술논문
Study of Solder Resist Crack Resistance for Flip Chip Ball Grid Array Substrate
Document Type
Conference
Author
Source
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1531-1535 May, 2023
Subject
Language
ISSN
2377-5726
Abstract
Study the methods to prevent the solder resist material of flip-chip ball grid arrays crack. Strategies of releasing the stored stress in substrate to improvement SR crack were demonstrated through process DOE. To observe the SR surface status and material properties after add an extra pre-curing process and fine tune the UV energy. The physical properties of SR film and the surface topography are same level. The adhesion between SR and ABF interface show no significant different. Observe the SR crack after difference TCT cycle times, the SR crack has been improved. A pre-curing process before UV curing is able to promote the solder resist crack resistance.