학술논문

Applications of SiGe Material for CMOS and Related Processing
Document Type
Conference
Source
2006 Bipolar/BiCMOS Circuits and Technology Meeting Bipolar/BiCMOS Circuits and Technology Meeting, 2006. :1-7 Oct, 2006
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Silicon germanium
Germanium silicon alloys
CMOS process
Crystalline materials
Heterojunction bipolar transistors
Boosting
Germanium alloys
Photonic band gap
Crystallization
Etching
SiGe
Ge
Strain
heterostructures
selective SiGe etching
Silicon On Nothing
Fully depleted devices
Double Gate devices
Language
ISSN
1088-9299
2378-590X
Abstract
Despite the fact that the main commercial heterostructure based on SiGe is the HBT, the CMOS R&D has also focused on the use of SiGe material for boosting the performances. SiGe alloys are indeed extensively used for their electrical properties (band gap engineering by adjusting the Ge content, carriers' mobility improvement...). New applications for CMOS are emerging that are based on the crystalline properties of the SiGe material: strained devices, high-mobility SiGe channel transistors or architectures where it is used as a sacrificial layer. The selective SiGe/Si etching can be used in several advanced microelectronics architectures that require a thin single-crystal Si film isolated from the substrate by a cavity. The capability to perform sustained mono-Si areas over an empty tunnel opens a wide range of applications for this technique, in particular for the realization of localized single-gate fully depleted transistors, double-gate or multi-channel devices, MEMS in nanoscale dimensions...