학술논문

A high-performance 0.5- mu m BiCMOS technology for fast 4-Mb SRAMs
Document Type
Periodical
Source
IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 39(7):1669-1679 Jul, 1992
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
BiCMOS integrated circuits
Random access memory
MOSFETs
Bipolar transistors
CMOS process
CMOS technology
Capacitance
Delay
MOS devices
Cutoff frequency
Language
ISSN
0018-9383
1557-9646
Abstract
A high-performance 0.5- mu m BiCMOS technology has been developed. Three layers of polysilicon are used to achieve a compact four-transistor SRAM bit cell size of less than 20 mu m/sup 2/ by creating self-aligned bit-sense and V/sub ss/ contacts. A WSi/sub x/ polycide emitter n-p-n transistor with an emitter area of 0.8*2.4 mu m/sup 2/ provides a peak cutoff frequency (f/sub T/) of 14 GHz with a collector-emitter breakdown voltage (BV/sub CFO/) of 6.5 V. A selectively ion-implanted collector (SIC) is used to compensate the base channeling tail in order to increase f/sub T/ and knee current without significantly affecting collector-substrate capacitance. ECL gate delays as fast as 105 ps can be obtained with this process.ETX