학술논문

Fin width scaling for improved short channel control and performance in aggressively scaled channel length SOI finFETs
Document Type
Conference
Source
2013 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2013 IEEE. :1-2 Oct, 2013
Subject
Components, Circuits, Devices and Systems
Fields, Waves and Electromagnetics
Photonics and Electrooptics
FinFETs
Logic gates
Robustness
Electrostatics
Process control
Market research
Performance evaluation
Language
ISSN
1078-621X
Abstract
This work presents SOI finFETs with fin width (Dfin) scaled to sub 15nm. The process flow provides robust Dfin scaling as depicted by the universal electrostatic scaling of the DIBL and sub-threshold swing (SS). The high field long channel mobility drops by ∼6% with Dfin scaling, however, DIBL and SS improves by ∼1.5X and ∼2X, respectively, for 20nm channel length n/pfinFETs. The effective current (Ieff) at fixed Ioff improves by ∼20% and ∼30% for p and n finFETs, respectively, with Dfin scaling.