학술논문

Results from the first prototype of large 3D active edge sensors
Document Type
Conference
Source
2011 IEEE Nuclear Science Symposium Conference Record Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC), 2011 IEEE. :1319-1323 Oct, 2011
Subject
Nuclear Engineering
Bioengineering
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Signal Processing and Analysis
Image edge detection
Three dimensional displays
Bonding
Nuclear measurements
Detectors
Language
ISSN
1082-3654
Abstract
3D active edge sensors have advantages such as radiation hardness and edgeless capability. With the use of deep reactive ion etching and wafer bonding, 18.5 by 20.5 mm 2 3D detectors with active edges have been successfully fabricated at SINTEF MiNaLab. These sensors are compatible with the ATLAS FE-I4 readout electronics. Fabrication process and difficulties are presented and the preliminary electrical measurements are also discussed.