학술논문
The Clean Sheet induced Contamination and their corresponding Failure Analysis
Document Type
Conference
Author
Source
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2020 IEEE International Symposium on the. :1-5 Jul, 2020
Subject
Language
ISSN
1946-1550
Abstract
In this paper, two aged clean sheet induced contamination cases was reported. The Optical Microscope, Scanning Electron Microscope, confocal Optical Microscope, Auger Electron Spectroscopy, and Focus Ion Beam were used to identify the root cause of the foreign material contaminated cases. The structure of aged clean sheet was also checked by top view and cross sectional Scanning Electron Microscopy inspection. The reflow experiment on solder bump had improved the availability in this contamination case.