학술논문
All lead free IGBT module with excellent reliability
Document Type
Conference
Source
Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005. Power semiconductor devices & ICs Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on. :79-82 2005
Subject
Language
ISSN
1063-6854
1946-0201
1946-0201
Abstract
The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.