학술논문

Study of the die position accuracy in the fabrication process of a die first type FO-PLP
Document Type
Conference
Source
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :509-513 Dec, 2018
Subject
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Electromagnetic compatibility
Temperature measurement
Material properties
Electronics packaging
Stress
Position measurement
Mathematical model
Language
Abstract
Die position accuracy is one of the important topics of the fabrication processes of die first fan out packages (FO-PKG). In this research, the die position accuracy and the compensation were studied by the combined approach of the sample preparation and the numerical calculation. As a result, the flow didn’t influence on the die shift significantly and the die shift could be estimated by the component material properties, which were the curing shrinkage of the EMC (epoxy molding compound), and the CTE (coefficient of thermal expansions) and the elastic moduli of the EMC, the TBA (temporary bonding adhesive) and the support. The value of the thermal die shift can be predicted by the developed formulasm. The pre-shift die mouting using the predicted value singnificanltly can suppress the thermal die shift.