학술논문

High Frequency Characteristics of Fine Copper Lines on High Rigidity Dielectrics
Document Type
Conference
Source
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :72-77 May, 2023
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Engineering Profession
Photonics and Electrooptics
Performance evaluation
Radiation effects
Surface impedance
Insulation
Strips
Glass
Scattering parameters
semi-additive process
UV irradiation
prepreg
copper plating
smooth interface
high-frequency performance
Language
ISSN
2377-5726
Abstract
The test vehicles for high-frequency performance evaluation are successfully formed on a smooth surface prepreg by semi-additive process (SAP) assisted by ultraviolet (UV) irradiation. The designs of fine strip line are determined by simulation calculation with consideration of the process margin. The test vehicles are fabricated using substrates made of prepreg with glass cloth or insulation film without glass cloth. As a result of measuring impedance and S parameters, the sample with prepreg shows better high-frequency performance than the sample with insulation film even though they has similar dielectric constant (Dk) and dielectric loss tangent (Df) values. The reason would be the smooth interface between the signal line and the prepreg due to the SAP assisted by UV irradiation. The SAP technology assisted by UV irradiation would be a solution for high-frequency application due to the smooth surface of the package composed of prepreg.