학술논문

Evidence of Hot-Hole Induced Degradation in Lateral NDRIFT MOSFET: Characterization and TCAD Analysis
Document Type
Periodical
Source
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 22(2):258-266 Jun, 2022
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Power, Energy and Industry Applications
Degradation
Logic gates
Hot carriers
Voltage measurement
Interface states
Stress
Semiconductor device measurement
Hot carrier degradation
LDMOSFET
hot-holes
DCIV
Ron degradation
capacitance degradation
Language
ISSN
1530-4388
1558-2574
Abstract
The role of secondary hot holes in the degradation of n-channel lateral drift MOSFETs, possibly leading to gate oxide breakdown, is discussed. Trapping of positive charges in the gate and field oxides and the formation of interface states under hot-carrier stress (HCS) have been successfully monitored by means of direct current current-voltage (DCIV) measurements and through gate-drain capacitance measurements. Experimental data have been complemented with Technology Computer Aided Design (TCAD) analysis. A degradation model including both hot-electrons and secondary hot-holes induced degradation capable of interpreting and reproducing measured data is proposed. Simulations allow to gain insights in the kinetics laws governing charge trapping and interface states generation along the silicon/oxide interface. The drift kinetics of the ON-state resistance have been also characterized and reproduced by simulations.