학술논문
Thermal characterization of diamond-pressure-bond heat sinking for optically pumped mid-infrared lasers
Document Type
Periodical
Author
Source
IEEE Journal of Quantum Electronics IEEE J. Quantum Electron. Quantum Electronics, IEEE Journal of. 35(11):1597-1601 Nov, 1999
Subject
Language
ISSN
0018-9197
1558-1713
1558-1713
Abstract
The heat-sinking properties of optically pumped semiconductor lasers mounted by the diamond-pressure-bonding (DPB) technique have been evaluated quantitatively. This method combines epi-side-down mounting with minimal processing and top optical access via pumping through the diamond. By correlating the pump-intensity variation of the emission wavelength with its temperature variation, specific thermal resistances have been determined for DPB-mounted type-II "W" lasers operating in the mid-infrared. Values