학술논문
Opportunities and challenges in ultra low k dielectrics for interconnect applications
Document Type
Conference
Author
Source
International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224) Electron devices meeting 2001 Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International. :23.2.1-23.2.4 2001
Subject
Language
Abstract
In this paper, we discuss the challenges associated with producing, characterizing and integrating porous dielectrics into back-end-of-line (BEOL) interconnects and present results from our integration evaluations.