학술논문
Canary devices for through-silicon vias a condition monitoring approach
Document Type
Conference
Source
2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :282-287 Apr, 2017
Subject
Language
Abstract
A methodology for the design of canary devices intended for condition monitoring is described in detail for through-silicon vias (TSVs). Two different canaries a geometry change canary and a load-exposure change canary are proposed. To evaluate the proposed canary design qualitatively a comparative finite element study was conducted.