학술논문

Study on the IGBT Short Circuit Type II Behavior Considering the Plasma Effect
Document Type
Periodical
Source
IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(1):491-499 Jan, 2023
Subject
Power, Energy and Industry Applications
Aerospace
Communication, Networking and Broadcast Technologies
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
General Topics for Engineers
Nuclear Engineering
Signal Processing and Analysis
Transportation
Logic gates
Insulated gate bipolar transistors
Voltage measurement
Plasmas
Current measurement
Plasma measurements
Inductance
Insulated gate bipolar transistor (IGBT)
plasma
short-circuit
TCAD-simulation
Language
ISSN
0885-8993
1941-0107
Abstract
The second type of short-circuit (SC II) of an insulated gate bipolar transistor (IGBT) considering the plasma is thoroughly studied in this article. The measurement and device simulation were performed for 1.2 kV IGBTs. Since the SC II is the failure during the IGBT conduction mode, the existing plasma within the IGBT plays an important role in IGBT SC II behavior. The first focus of this article is to understand the composition of the current peak at the beginning of the SC II, which is produced by the Miller-effect during the desaturation process and the sweep-out of the internal plasma. Further, the induced voltage caused by the current decay after the current peak is investigated. The interaction between current decay and the IGBT internal physical mechanism is discussed under different test conditions.