학술논문

3-D Modeling of Thermal Exchange in the PV Module During Lamination: Impact of Architecture, Laminator Configuration, and Lamination Recipe
Document Type
Periodical
Source
IEEE Journal of Photovoltaics IEEE J. Photovoltaics Photovoltaics, IEEE Journal of. 12(1):107-113 Jan, 2022
Subject
Photonics and Electrooptics
Heating systems
Presses
Lamination
Cooling
Heat transfer
Temperature measurement
Monitoring
3-D thermal modeling
finite-element simulations
lamination process
lamination recipe
photovoltaic (PV) module architecture
stress
virtual prototyping
Language
ISSN
2156-3381
2156-3403
Abstract
The following study aims in describing the impact of the architecture of the photovoltaic (PV) module and lamination recipe on the thermal exchange between the laminator and the PV module for different configurations. First, the PV module temperature evolution was measured during the lamination process, using temperature sensors. These temperature sensors were placed at different positions in the PV module to study the temperature gradient in the thickness and the temperature side effects. Second, data were fitted using an analytical model, developed for each lamination case to calculate the thermal exchange coefficient in double side heating plate and cooling press. Finally, the resultant coefficient was implemented numerically into a 3-D finite element model. Results reveal a correlation between experimental, analytical, and numerical temperature profiles. Experimental curves show that the corner of the PV module heats and cools down faster than the center, due to the thermal exchange between the edge of the PV module and the air in the chamber. A temperature gradient in the thickness was mainly observed in the first step of lamination (membrane/press). Numerically, we found that this temperature gradient depends on the presence of air trapped around the thermocouple, which influences the heat transfer between the layers of the PV module. In vacuum/membrane press, the heat transfer coefficient has been defined numerically due to the asymmetrical loading. This coefficient is strongly affected by the lamination recipe and the laminator configuration.