부산대학교 도서관

Three-dimensional (3-D) detectors have many potential advantages over standard planar devices and for a range of applications, e.g., high energy physics, synchrotron radiation detection and medical imaging. One such area is minimizing the effects due to charge sharing between adjacent pixels. Simulations of pixel detector compatible with the Medipix2 chip show that 3-D detectors have significant advantages in this area. In addition, a 64/spl times/64 pixel 3-D detector designed for read-out by the Medipix1 chip has been fabricated. The sensors have been characterized using current-voltage and capacitance measurements. They are currently being bump-bonded to the Medipix1 chip at the University of Freiburg in order for the complete system to be evaluated using a X-ray source.