학술논문

Assessment of Ionizing Radiation Hardness of a GaN Field-Effect Transistor
Document Type
Conference
Source
2019 34th Symposium on Microelectronics Technology and Devices (SBMicro) Microelectronics Technology and Devices (SBMicro), 2019 34th Symposium on. :1-4 Aug, 2019
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Radiation effects
Gallium nitride
HEMTs
MODFETs
Aluminum gallium nitride
Wide band gap semiconductors
Total Ionizing Dose
Radiation Effects
GaN HEMTs
Harsh environments
Language
Abstract
This work addresses the effects of Total Ionizing Dose (TID) on a Gallium Nitride (GaN) transistor before, during and after exposing to radiation, and also the comparison between biasing or not, during radiation exposition. These High Electron Mobility Transistors (HEMTs) were exposed to 10-keV X-rays effective energy and tested in a controlled temperature environment. Radiation doses varied in a wide range up to 350 krad. The results show that the devices analyzed, the commercial off-the-shelf (COTs) GaN - GS61008T, suffer few effects of ionizing radiation, and recover their electrical characteristics, especially when in on-state mode, indicating they are good candidates for use in harsh environments.