학술논문

Mathematical model of shaping of a ultrathin SiO/sub 2/ layer at a high-temperature oxidation of silicon
Document Type
Conference
Source
2003 IEEE Conference on Electron Devices and Solid-State Circuits (IEEE Cat. No.03TH8668) Electron devices and solid-state circuits Electron Devices and Solid-State Circuits, 2003 IEEE Conference on. :365-368 2003
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Mathematical model
Oxidation
Silicon
Polymers
Chemicals
Atomic layer deposition
Concrete
Lattices
Language
Abstract
On the grounds of beliefs about polymeric structure of a ultrathin silicon dioxide layer obtained by a rapid thermal oxidation (RTO) in a temperature range 950-115/spl deg/C, the model of structure of a boundary layer in a system Si/SiO/sub 2/ is offered. The semiquantitative analysis of a spatial distribution of polymetric compounds of different length in a boundary layer is carried out. The outcomes of model operation indirectly prove to be true by known experimental datas.