학술논문

Dependence of Gate Leakage Current on Efficacy of Gate Field Plate in AlGaN/GaN HEMT
Document Type
Conference
Source
2022 IEEE VLSI Device Circuit and System (VLSI DCS) VLSI Device Circuit and System (VLSI DCS), 2022 IEEE. :265-268 Feb, 2022
Subject
Bioengineering
Components, Circuits, Devices and Systems
Computing and Processing
Engineered Materials, Dielectrics and Plasmas
Photonics and Electrooptics
Signal Processing and Analysis
Electric breakdown
Logic gates
HEMTs
Very large scale integration
Gate leakage
Wide band gap semiconductors
MODFETs
Field Plate
GaN HEMT
gate reverse leakage
breakdown voltage
hump in the breakdown
Language
Abstract
GaN HEMTs finds applications in Radio Frequency (RF) and high-power device and sensing applications. Several types of GaN HEMT device structures have been studied and are being used in various forms. In this article, a comparative study of gate field plated device with a conventional GaN HEMT device has been studied. A close relationship in gate leakage current with off-state breakdown pattern has been observed. The field plate starts working after a certain rise in the gate-drain electric field creating a hump in off-state breakdown characteristic. In low gate leakage device this pattern is absent signifying the effectiveness of gate field plate in fix voltage range.