학술논문

Electrical properties of a graphene nanoplatelets composite as interposer for electronic packages
Document Type
Conference
Source
2018 IEEE 22nd Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2018 IEEE 22nd Workshop on. :1-4 May, 2018
Subject
Components, Circuits, Devices and Systems
Engineered Materials, Dielectrics and Plasmas
Fields, Waves and Electromagnetics
Silicon
Graphene
Conductivity
Permittivity
Economic indicators
Microstrip
Microwave circuits
Graphene composite
Interposers
Packages
Language
Abstract
This paper deals with the electrical characterization of a graphene-based material that can be proposed for realizing novel interposers to improve the electrical performance of the electronic packages. The material is a low-cost version of the graphene, realized with commercial graphene nanoplatelets, and thus potentially suitable for a large mass production. An electrical characterization of its complex permittivity in the microwave range is here provided, by using a technique based on the measurement of the scattering parameters on a microstrip-like test vehicle. A Drude model is used to retrieve the values of the equivalent complex permittivity. The results demonstrate that this material may outperform the silicon so far used for interposers.