학술논문

FABRIC8LABS: Electrochemical Additive Manufacturing (ECAM) For Cooling High Performance ICs

Document Type

Conference

Author

Winfield, Ian; Madril, Joseph; Ouradnik, Tim; Matthews, Michael; Romero, Guillermo

Source

2023 IEEE Hot Chips 35 Symposium (HCS) Hot Chips 35 Symposium (HCS), 2023 IEEE. :1-18 Aug, 2023

Subject

Components, Circuits, Devices and Systems
Computing and Processing
Liquid cooling
Cold plates
Three-dimensional printing
Thermal management
Thermal analysis
Heat transfer
Thermal resistance

Language

ISSN

2573-2048

Online Access

Full Text (IEEE) Find it@PNU

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