학술논문

Uncertainty Quantification in Prediction of the In-Plane Young's Modulus of Thin Films With Fiber Texture
Document Type
Periodical
Source
Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 23(2):380-390 Apr, 2014
Subject
Engineered Materials, Dielectrics and Plasmas
Components, Circuits, Devices and Systems
Young's modulus
Uncertainty
Crystals
Microstructure
Tensile stress
Geometry
Strain
Crystallographic texture
experimental uncertainties
fiber texture
Hill average
in-plane Young's modulus
MEMS
Reuss
Voigt
Language
ISSN
1057-7157
1941-0158
Abstract
Electrodeposited thin films in MEMS devices often show fiber texture resulting in transverse isotropic, effective elastic properties. It is of interest to predict these elastic properties since they play a role in device performance. In addition to predicting effective material properties of the devices, we quantify the uncertainty in our predictions of these material properties for use in downstream simulations aimed at studies of performance, lifetime, or reliability. In this paper, we estimate the numerical value of the effective in-plane Young's modulus of thin nickel polycrystalline films using numerical simulation. We also examine the variability and sensitivity of the in-plane Young's modulus due to uncertainties in microstructure geometry, crystallographic texture, and numerical values of single-crystal elastic constants. The importance of accurate characterization of the texture is shown, as is the sensitivity of the effective in-plane Young's modulus to single-crystal elastic moduli. $\hfill{[2013\hbox{-}0118]}$